NEPTCO dicing tapes help semiconductor and electronic component manufactures achieve precise and reliable wafer yields. WAFERTAPE® products consist of a specially-formulated base film coated with a pressure-sensitive adhesive and a protective release liner. WAFERTAPE® materials are fully compliant with Electronics Industry Association (EIA)481 requirements, Sony Green Standard SS-00259, and Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) requirements. For more information contact Business Unit Manager Mark Canrobert, MCanrobert@neptco.com